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SPUTTER COATERS / VACUUM COATING SYSTEMS - Triple Magnetron Target Desk Sputter Coater – TTDST3

This servo-hydraulic Universal Testing Machine is ideal for high-capacity tension, compression, bend/flex, and shear testing. It is in accordance with the EN, ISO, ASTM, JIS, GB and many other standards. These frames feature dual spaces so users can quickly change between tension and compression testing without having to remove heavy fixtures.

Torontech is being increasingly recognized as a standard for accuracy, dependability and versatility in servo-hydraulic universal testing machines.

The TTDST3 is a desk top, triple target, turbo molecular vacuum pumped sputter coater, suitable for sputtering semiconductors, dielectrics, metals, and metal oxides. An evaporation source for thermal evaporation source can also be mounted on device for thermal evaporation process.

The TTDST3 is equipped with a large chamber and a water circulation cooling system for each cathodes which make it suitable for sputtering; a single large diameter specimen; and co-sputtering; a small diameter specimen.

According to state of the cathodes, TTDST3 is available in two models:

TTDST3 – A (Angled Cathodes):

The TTDST3-A is equipped with three angled cathodes with a common focal point. It can sputter from two or three targets simultaneously or independently to form alloys or multilayer deposition respectively.

TTDST3 – S (Straight Cathodes):

TTDST3-S with three straight cathodes is suitable for sputtering a single large specimen with a diameter up to 20 Cm or several small specimens.

The magnetron desk sputter coater is equipped with RF and DC power supplies It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets. The system is equipped with an easy-adjustable matching box, minimizing the reflected power in the RF sputtering. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate.

  • Metal, Semiconductor and Dielectric Films
  • Nano & Microelectronic
  • Solar cell applications
  • Co-Sputtering processes
  • Glad sputtering
  • Optical components coating
  • Thin film sensors
  • Magnetic thin film devices
  • Computer memory applications
  • Fine grain structural deposition  for SEM  &  FE-SEM sample preparation
  • High vacuum turbo pump 90 l/s
  • Diaphragm backing pump
  • Full range vacuum gauge
  • Three 2” water - cooled sputtering cathodes
  • Large chamber suitable for large specimen depositions
  • Target selection for multilayer thin films
  • Co – sputtering to form alloy films
  • Two Quartz crystal monitoring system for real time thickness measurement (1 nm precision)
  • Manual or automatic Timed and Thickness deposition
  • Intuitive touch screen to control the coating process and rapid data input
  • User friendly software that can be updated via network
  • Equipped with electronic shutter
  • Equipped with rotary sample holder with the ability of tilting in direction of cathodes
  • 500 °C substrate heater
  • 300 V DC substrate bias voltages
  • Unlimited sputtering time without breaking vacuum
  • two-year warranty
  • Ultimate Vacuum: Less than 2x10-5 Torr
  • Independent  sputtering  control  rate  for  each  cathode  to  produce  fine  grain structures
  • Automatic control of sputtering power independent of pressure
  • Automatic control of the cathode's temperatures to protect the life time of the magnets
  • Data is rapidly registered by using fully automatic touch screen control
  • Precision Mass Flow meter (MFC) for fine control of vacuum and pressure
  • Records and plots coating parameters graphs.
  • Transfers curves and deposition process data by a USB port to PC
  • 0-1000 mA DC power supply
  • Utilities: 220V- 50HZ- 16A
  • Box Dimensions: 50 Cm H x 60 Cm W x 47 Cm D
  • Shipping Weight: 100kg  (pump, rack and box)
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