INSIGHT Electronic Application Scopes
Printed Circuit Board, Electronic Components, Wafer, IC Packaging Industry
INSIGHT Electronic Application Scopes endeavors to provide precise and efficient analysis methods for coating analysis applications.
Coating thickness stands as a pivotal factor in guaranteeing the reliability and stability of product quality within the electronics industry. Thus, maintaining quality control and assurance over coating thickness holds significant importance.
X-ray fluorescence (XRF) has emerged as a widely adopted technique for measuring coating thickness and composition due to its non-destructive nature, rapid measurement capabilities, and ease of use.
With user-friendly operation and adaptable configuration, INSIGHT Electronic Application Scopes effortlessly tackles ultra-thin coatings, delivering swift, accurate, and consistent results. This capability aids numerous industries, including PCB, semiconductor, and other electronics-related sectors, in enhancing productivity effectively.
By ensuring compliance with specifications, INSIGHT Electronic Application Scopes mitigates the risks associated with poor performance and the costs linked to scrap or rework, thereby bolstering overall efficiency and reducing potential setbacks.
Printed Circuit Boards
Gold/Nickel/Copper/Printed Circuit Board (PCB); Tin/Copper/PCB; Gold/Nickel Phosphorus/Copper/PCB; Silver/Copper/PCB; Tin/Copper/PCB; Tin Palladium/Copper/PCB; Gold/Palladium/Nickel Phosphorus/Copper/PCB
Connector Plating
In the electronics and electrical industry, the adoption of protective and wear-resistant coatings for electrical contacts is on the rise. Serving as vital components of electrical connectors, surface treatments enhance the corrosion resistance and wear resistance of the contacts, while optimizing their transmission functionality to a significant degree. Copper alloy typically serves as the base material for electrical connector contacts, with commonly used plating layers including tin plating, gold plating, silver plating, nickel plating, palladium plating, and so forth.
Wafer Manufacturing (Semiconductor)
A wafer refers to the silicon wafer utilized in fabricating silicon semiconductor integrated circuits. In the production process, the wafer undergoes electroplating, where a layer of conductive metal is electroplated onto it. Subsequently, this conductive metal layer is processed to form a conductive circuit. As the fundamental material of the chip, the wafer demands precise specifications for the electroplating layer, thus necessitating stringent process requirements. During wafer plating, ensuring uniformity and thickness of the coating is essential to uphold the quality of the wafer.
Lead frame
The lead frame is a thin metal plate frame that links the contact points of the internal chips within semiconductor integrated blocks to external wires. It serves as a primary structural material for semiconductor packaging. To ensure optimal mounting and bonding performance during the packaging process, the lead frame requires special surface treatment. Common plating elements for lead frames include gold, silver, palladium, nickel, and others.
Multi-collimator
The system offers optional multiple collimators or automatically switches between collimator combinations via software. This flexibility allows seamless handling of parts with different sizes.
Up-bottom Design
The instrument features an up-bottom design, enabling quick, precise, stable, and efficient measurement of super-large, irregular, small, and even liquid samples with ease.
High Intensity X-ray Tube
INSIGHT can be outfitted with a high-intensity capillary optical system, enhancing the instrument's count rate, precision in point measurement, and capability to measure thinner coatings. This upgrade significantly boosts the analysis efficiency of the instrument.
Highly sensitive detector
For intricate coating structures, the SDD series detectors offer advantages in analyzing elements with XRF-like characteristics. These detectors provide better resolution, lower background noise (resulting in the highest signal-to-noise ratio), and enhanced accuracy in measuring thinner coatings.
Auto Focus
Samples are swiftly brought into focus within seconds, irrespective of their thickness or size. The instrument can measure samples from distances of up to 80 mm. It excels in measuring parts with recessed areas and is well-suited for measuring multiple samples at varying heights.
Programmable automatic displacement sample stage
The instrument features an automatic platform that facilitates seamless automatic measurements. This capability enables faster sample preparation and measurement, thereby boosting analysis throughput.
One-touch measurement
The instrument comes equipped with intuitive and intelligent analysis software, ensuring easy operation for users of all levels of expertise. Testing samples requires no specialized training; simply click "Start Test," and results are obtained within seconds.
Large measurement room
The slotted design (C-slot) of the instrument shell creates a spacious measurement area, facilitating easy placement of samples. This design accommodates large and flat items like printed circuit boards, as well as large samples with intricate shapes.
Increase productivity
INSIGHT automation accelerates sample measurements, boosting your throughput.
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The characteristics of |
Top-down measurement structure, XYZ measurement platform, MUTI-FP multilayer algorithm
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Scope of element |
Na(11)—Fm(100)
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Analysis of the layer number of |
5 layers (4 layers + substrate) each layer can analyze 10 elements, composition analysis can analyze up to 25 elements
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X-ray tube |
50 W (50 kV, 1mA) micro-focused tungsten palladium ray tube (target material is optional)
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The detector |
High sensitivity large area SDD detector, SDD 50mm2 large area detector, (optional)
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Collimator |
Multiple collimators are optional, and multiple collimators can be combined
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The camera |
High resolution CMOS color camera, 5 megapixels
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Manual sample XY platform |
Moving range：100 x 150 mm
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Programmable XY platform |
(Optional)
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Z-axis range of movement |
150 mm
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Sample bin size |
564×540×150mm(L x W x H)
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Overall dimensions |
664×761×757mm(L x W x H)
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Weight |
120KG
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The power supply |
AC 220V±5V 50Hz (110V also available)
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Rated power |
150W
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HOW CAN WE HELP YOU ?
Contact our sales team for a quotation.
