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SPUTTER COATERS / VACUUM COATING SYSTEMS - Desktop Sputter Coater straight magnetrons with thermal evaporation – TTDST3-T Series

This servo-hydraulic Universal Testing Machine is ideal for high-capacity tension, compression, bend/flex, and shear testing. It is in accordance with the EN, ISO, ASTM, JIS, GB and many other standards. These frames feature dual spaces so users can quickly change between tension and compression testing without having to remove heavy fixtures.

Torontech is being increasingly recognized as a standard for accuracy, dependability and versatility in servo-hydraulic universal testing machines.

TTDST3-T is a triple-target, turbo molecular-pumped, multi vacuum coater system, combines thermal evaporator and sputter coater in one single compact desktop system. The high vacuum system is suitable for the deposition of a wide range of materials. Triple magnetron target desk sputter coater can easily switch between evaporation and sputtering condition (Not Simultaneously).

The TTDST3-T, Magnetron Desk Sputter Coater, is equipped with a large chamber (300 mm diameter) and three 2” diameter water cooled cathodes which make it suitable for long time deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets.

The system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate(optional).

TTDST3 – TA (Angled Cathodes):

The TTDST3-TA is equipped with three angled cathodes with a common focal point. It can sputter from two or three(optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3 inches.

TTDST3 –TS (Straight Cathodes):

TTDST3-TS with three straight 2 inches water cooled cathodes is suitable for sputtering a single large specimen with diameter up to 20 cm or several small specimens.

  • Sputtering and Thermal evaporation process in a compact system
  • High vacuum level
  • Equipped with DC and RF power supplies suitable for metals, semiconductors and dielectrics
  • Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films(DST3-TA) and multilayer deposition
  • One thermal source installation
  • Two fixed and movable quartz crystal monitoring system for real time thickness measurement(1 nm precision)
  • Two MFCs
  • Manual or automatic Timed or Thickness deposition
  • Intuitive touch screen to control coating process and rapid data input
  • User friendly software that can be updated via network
  • Equipped with 3 manual shutters
  • Tillable and change height of rotary sample holder with ability to selection of the cathodes
  • 500 °C substrate heater(optional)
  • 300 V DC substrate bias voltages(optional)
  • Unlimited deposition time without breaking vacuum
  • High vacuum turbo pump
  • Pumping Speed 90 l/s 350 l/s
  • Ultimate Pressure 7×10-6 Torr 7×10-7 Torr
  • Two stage rotary vane pump 4 m3/h
  • Independent sputtering control rate for each cathode to produce fine grain structures
  • Automatic control of deposition power independent of pressure
  • Automatic control of the cathode’s temperatures to protect the life time of the magnets
  • Two precision Mass Flow Controller (MFC) for fine control of Ar flow and so reactive sputtering gas
  • Records and plots of coating parameters graphs
  • 300V DC bias voltage(optional)
  • Equipped to plasma cleaner(optional)
  • Equipped to 500˚C substrate heater(optional)
  • DC power supply 0-1200V, 0-500 mA
  • 0-24 V, 0-100 A high current power supply
  • Water cooled high current electric feedthrough
  • 300 W RF power supply with automatic matching box
  • Utilities: 220V-240V, 50/60HZ, 16A
  • Box Dimensions: 50 cm H x 60 cm W x 47 cm D
  • Shipping Weight: 160 kg(Pump, Rack and Box)
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